Low Profile XY Stages

corp-profile-wafer-backrounTo meet the ever increasing demands of the semiconductor industry, LEP has a full line of high accuracy, high performance stages. Designed to eliminate compromise, these stages offer the best performance available in a low profile microscope stage

Attention to detail in design, manufacturing and components are keys to the quality of the final product. Each stage uses a highly refined, evolved design that is proven with every stage. All critical components are machined on state of the art machining centers in LEP’s machine shop for the highest level of control. All components are inspected and measured to exacting specifications. Our ISO-9001 registered quality system ensures that only perfect parts are used.

We recognize that the wafer fab can be a harsh environment. Stages need to be designed with this in mind to deliver the highest performance and availability in this environment. The LEP semiconductor stages are rugged and durable in production industrial environments. With minimal recommended maintenance, these stages will provide many years of performance meeting or exceeding specifications. All surfaces are anodized aluminum, no paint is used. The guide bearings are stainless steel for corrosion resistance.

Precision and repeatability is assured by the use of high resolution rotary encoders mounted to the leadscrew shaft or linear scales embedded directly into the stage. Zero backlash ballscrews ensure high accuracy and long life. Precision ground crossed roller bearing guideways enhance the performance of these stages.

Wafer Handling Robots

Unique Design

The LEP robot has many design features that make it unique. The top-side design of the robot makes simplifies service and maintenance. The telescoping lift axis provides long range of motion while requiring very little space. The linear radius axis and precision rotation axis ensure the highest wafer placement accuracy.

Flexible Integration

A rich command set with communication via RS-232 or USB interface provides for multilevel host control. At the most fundamental level, full control of all motion parameters and servo characteristics is available. In addition, a complete high level command set provides control of wafer transport, system status and error handling.

High Reliabilty

The LEP 200 mm robot is designed for high reliability. There are no complicated mechanisms, drive trains or multi-link arms that are prone to failure and misalignment